Interconnection method and structure for organic circuit boards

Details Interconnection method and structure for organic circuit boards Interconnection method and structure for organic circuit boards

1992-07-14

1994-03-29

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 361792, H05K 1100

Patent

active

052986853

ABSTRACT:
Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

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