Interconnection method and structure for organic circuit boards

Details Interconnection method and structure for organic circuit boards Interconnection method and structure for organic circuit boards

1994-02-14

1995-07-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 174255, H05K 336

Patent

active

054350573

ABSTRACT:
Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

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