Interconnection lines for wafer-scale-integrated assemblies

Wave transmission lines and networks – Plural channel systems

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

333238, 333246, 174117FF, 174117PC, 174 685, H01P 308

Patent

active

047032880

ABSTRACT:
In wafer-scale-integrated assemblies, microminiature transmission lines are utilized as interconnects on the wafer. The extremely small cross-sectional area of a typical such line results in its total line resistance being relatively large. Such a line exhibits signal reflections and resonances. In practice, it is not feasible to eliminate these effects by conventional load termination techniques. As a result, the frequency at which digital signals can be transmitted over such a line is typically limited to well below its so-called resonance limit. In accordance with a feature of the invention, the structural parameters of each line are selected to meet specified design criteria that ensure optimal high-frequency performance of the line.

REFERENCES:
patent: 3191055 (1965-06-01), Swihort et al.
patent: 3370184 (1968-02-01), Zuleeg
patent: 3519962 (1970-07-01), Lind
patent: 3906387 (1975-09-01), Martel et al.
patent: 4210885 (1970-07-01), Ho
patent: 4233579 (1980-11-01), Carlson et al.
Miersch, E. F. et al., "Analysis of Lossy Coupled Transmission Lines", IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, pp. 2363-2365.
Jones, R. A. et al., "Thin Film Electronic Circuits", IBM Technical Disclosure Bulletin, vol. 3, No. 10, Mar. 1961, p. 101.
Schellenber, I. M. et al., "A FET Chip Level Well Combiner", 1981, IEEE Int'l. Solid State Circuits Conference, New York, Feb. 18, 1981.
Proceedings of the IEEE International Conference on Computer Design, Rye, New York, 1983, "Thin Film Interconnection Lines for VLSI Packaging", by A. Deutsch et al, pp. 222-226.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interconnection lines for wafer-scale-integrated assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection lines for wafer-scale-integrated assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection lines for wafer-scale-integrated assemblies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1274366

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.