Interconnection devices

Details Interconnection devices Interconnection devices

2007-08-14

2007-08-14

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S876000, C029S882000, C029S884000, C029S842000, C029S844000, C439S066000, C439S591000, C439S862000, C324S754090

Reexamination Certificate

active

09947240

ABSTRACT:
A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located on a small center distance, i.e. pitch, and to electrically connect with contact pads of high density electronic devices, having a small device pitch. The device pitch can be smaller than the diameter of the spring body itself. In order to achieve this desired small spring pitch and high density, the contact springs are located in a nested head-to-toe and/or staggered orientation. Furthermore, the connectors utilize guide plates, referred to as combs, to accurately control the alignment of the contact springs tips to the contact pads of the electronic devices.

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