Interconnection device including one or more embedded vias...

Details Interconnection device including one or more embedded vias... Interconnection device including one or more embedded vias...

2005-06-28

2009-10-27

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S048000, C438S051000, C438S064000, C257SE21499, C257SE21522, C257S414000

Reexamination Certificate

active

07608470

ABSTRACT:
“An interconnection device comprises a Systems In Package (SIP) device, or Systems in Chip (SIC) device, including one or more embedded vias extending through a base substrate. A process to produce the interconnection device.”

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Chinese Office Action of Application No. 200610121498.2 Dated Sep. 12, 2008.

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