Interconnection construction to thick film substrate

Details Interconnection construction to thick film substrate Interconnection construction to thick film substrate

1982-12-27

1984-09-11

Desmond, Eugene F.

Geometrical instruments

174 52PE, 339 17CF, 361421, A01R 306

Patent

active

044706480

ABSTRACT:
An integral lead frame for a thick film substrate mounted in a housing has three portions. A first portion in the interior of the housing contacts the thick film substance with stress relieved terminals having an arcuate hoop and reduced width. A second portion includes vertical steps for changing the plane of the lead frame. The third portion includes a connector blade with a thickness greater than the terminal thickness.

REFERENCES:
patent: 2985806 (1961-05-01), McMahon et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4158745 (1979-06-01), Keller
patent: 4234666 (1980-11-01), Gursky
patent: 4335463 (1982-10-01), Burns

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