Interconnection card and methods for manufacturing and connectin

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361728, 361752, 361790, 437219, H05K 114, H01L 2156

Patent

active

057175730

ABSTRACT:
Both sides of a wiring board have electric components mounted thereon and both sides are supported by bracing pins projecting from the inner surfaces of a metal mold. The mold is filled with resin from a plunger into a cavity formed by a top shell and a bottom shell of the mold, the filling pressure acts to deform the wiring board, but the wiring board 12 is not deformed or damaged, because the board is braced by the supporting pins from both sides. The supporting pins result in holes extending from the surface of the sealing layer to the wiring board after the sealing. Conductive springs are placed in the holes and conductive plates are placed on the top and bottom of the sealing layer with the springs compressed to electrically connect between the wiring board and plates. Alternatively, or in addition to the pins components and/or metal connectors mounted on the wiring board extend to the mold surface to brace the circuit board and provide electrical connection to the wiring board through the components or metal connectors. Metal plates connected to the springs and/or connectors are applied to the surface of the interconnect board.

REFERENCES:
patent: 5244840 (1993-09-01), Kodai et al.

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