Interconnection between different circuit types

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257SE23174, C257SE21578, C438S640000

Reexamination Certificate

active

07659631

ABSTRACT:
A hybrid-scale electronic circuit, an internal electrical connection and a method of electrically interconnecting employ an interconnect having a tapered shape to electrically connect between different-scale circuits. The interconnect has a first end with an end dimension that is larger than an end dimension of an opposite, second end of the interconnect. The larger first end of the interconnect connects to an electrical contact of a micro-scale circuit and the second end of the interconnect connects to an electrical contact of a nano-scale circuit.

REFERENCES:
patent: 5269880 (1993-12-01), Jolly et al.
patent: 6875671 (2005-04-01), Faris
patent: 6905955 (2005-06-01), Basceri et al.
patent: 7033910 (2006-04-01), Faris
patent: 7056751 (2006-06-01), Faris
patent: 10-2004-0045111 (2002-11-01), None
Charles M. Lieber, “The Incredible Shrinking Circuit”, Scientific American, Sep. 2001, pp. 59-64.

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