Interconnecting substrate for carrying semiconductor device,...

Details Interconnecting substrate for carrying semiconductor device,... Interconnecting substrate for carrying semiconductor device,...

2008-03-04

2008-03-04

Lebentritt, Michael (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S067000, C438S107000, C438S406000, C438S455000, C438S622000, C438S623000, C438S624000, C438S625000, C438S626000, C438S686000, C257S758000, C257S759000, C257S760000

Reexamination Certificate

active

10997986

ABSTRACT:
An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a way that, at least, a lateral face of an obverse end of the electrode is all round brought into contact with the insulating layer, while, at least, a reverse surface of the electrode is not in contact with said insulating layer; a via conductor which is disposed on an obverse surface of the electrode and formed in the insulating layer so as to connect this electrode with the interconnection; and a supporting structure on the surface of the insulating layer.

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