Interconnecting substrate for carrying semiconductor device,...

Details Interconnecting substrate for carrying semiconductor device,... Interconnecting substrate for carrying semiconductor device,...

2005-03-01

2005-03-01

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

Reexamination Certificate

active

06861757

ABSTRACT:
An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a way that, at least, a lateral face of an obverse end of the electrode is all round brought into contact with the insulating layer, while, at least, a reverse surface of the electrode is not in contact with said insulating layer; a via conductor which is disposed on an obverse surface of the electrode and formed in the insulating layer so as to connect this electrode with the interconnection; and a supporting structure on the surface of the insulating layer.

REFERENCES:
patent: 5830563 (1998-11-01), Shimoto et al.
patent: 6156414 (2000-12-01), Shimoto et al.
patent: 6204565 (2001-03-01), Shimoto et al.
patent: 20020024138 (2002-02-01), Shimoto et al.
patent: 5-259639 (1993-10-01), None
patent: 6-260763 (1994-09-01), None
patent: 7-283539 (1995-10-01), None
patent: 9-214141 (1997-08-01), None
patent: 9-307234 (1997-11-01), None
patent: 10-200015 (1998-07-01), None
patent: 10-335826 (1998-12-01), None
patent: 11-067849 (1999-03-01), None
patent: 11-163022 (1999-06-01), None
patent: 2000-3037 (2000-01-01), None
patent: 2000-3980 (2000-01-01), None
patent: 2000-323613 (2000-11-01), None
patent: 324384 (2001-11-01), None

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