Interconnecting microfluidic package and fabrication method

Details Interconnecting microfluidic package and fabrication method Interconnecting microfluidic package and fabrication method

2005-01-27

2009-08-04

Noguerola, Alex (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S601000, C204S643000, C137S814000, C137S833000, C422S091000

Reexamination Certificate

active

07569127

ABSTRACT:
A one-piece, microfluidic package with standardized multiple ports allows devices to be connected in series without resorting to extra tubing connections or bonding processes. The one-piece construction consists of microfluidic channels that can be connected to fluid reservoirs and other fluidic components fabricated with interconnecting and interlocking ports. The size of the friction-fit interlocking ports is designed such that the smaller male port fits snugly into the larger female port in a manner that is leak-free and adhesive-free. The friction-fit ports can also be reconfigured. Thus, the interconnection of microfluidic packages can be in an extended series including connections to sensors and devices such as a bio/biochemical/chemical sensor chip, a dielectrophoretic manipulator chip, and a microfluidic reactor chip.

REFERENCES:
patent: 3465774 (1969-09-01), Kautz et al.
patent: 5580523 (1996-12-01), Bard
patent: 5882465 (1999-03-01), McReynolds
patent: 6086825 (2000-07-01), Sundberg et al.
patent: 6251343 (2001-06-01), Dubrow et al.
patent: 6454924 (2002-09-01), Jedrzejewski et al.
patent: 6615857 (2003-09-01), Sinha et al.
patent: 6645432 (2003-11-01), Anderson et al.
patent: 2002/0023684 (2002-02-01), Chow
patent: 2002/0093143 (2002-07-01), Tai et al.
patent: 2002/0124896 (2002-09-01), O'Connor et al.
patent: 2003/0206832 (2003-11-01), Thiebaud et al.
patent: 2003/0224506 (2003-12-01), Agrawal et al.
patent: 2004/0017078 (2004-01-01), Karp et al.
Gonzalez, C., et al., “Fluidic interconnects for modular assembly of chemical microsystems”, Sensor and Actuators, B, vol. 49, Jun. 25, 1998, pp. 40-45.
Puntambekar, et al., “Self-aligning microfluidic interconnects for glass- and plastic-based microfluidic systems” J. Micromech. Microeng. (2002) vol. 12 pp. 35-40.
Pattekar, et al., “Novel microfluidic interconnects for high temperature and pressure applications” J. Micromech. Microeng. (2003) vol. 13 pp. 337-345.
C. Gartner, et al., Polymer Based Microfluidic Devices—Examples for Fluidic Interfaces and Standardization Concepts, Proceedings of SPIE—International Society of Optical Engineering, vol. 4982, p. 99-104, Jan. 27-29, 2003.

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