Interconnected printed circuits and method of connecting them

Details Interconnected printed circuits and method of connecting them Interconnected printed circuits and method of connecting them

1975-12-02

1977-12-20

Grimley, Arthur T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29625, H05K 100

Patent

active

040643573

ABSTRACT:
A method of making and electrically interconnecting layers of printed circuitry involves the steps of: (1) coating an insulator on both sides with an adhesive; (2) punching holes through the insulator at points where interconnections are to be made; (3) laminating conductor planes to both sides of the insulator by means of the adhesive; (4) forming printed circuit patterns on the conductors such that a proper conductor geometry is created at the points where the interconnections are to be made; (5) applying pre-punched, adhesive-coated cover layers of insulation over the exposed printed circuits, except in the area of the interconnections; and (6) applying solder to the conductor pattern. Since the geometry at the interconnections is carefully controlled a solder bridge is formed, which connects the two conductor patterns during step (6) by the flow of solder into the interconnection area, past the upper conductor, to the lower conductor. Alternatively, solder can be deposited between the conductor planes at the interconnection points during the formation of the laminate. In such case the conductor geometry at the interconnection points can be arbitrary.

REFERENCES:
patent: 2683839 (1954-07-01), Beck
patent: 2889393 (1959-06-01), Berger
patent: 3052823 (1962-09-01), Anderson et al.
patent: 3098951 (1963-07-01), Ayer et al.
patent: 3228093 (1966-01-01), Bratton
patent: 3315133 (1967-04-01), Walker
patent: 3557446 (1971-01-01), Charschan
patent: 3680209 (1972-08-01), Hacke

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