Interconnected multilayer boards and fabrication processes there

Details Interconnected multilayer boards and fabrication processes there Interconnected multilayer boards and fabrication processes there

1993-03-22

1994-04-05

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174256, 174262, 174265, 361792, 428901, I05K 100

Patent

active

053007352

ABSTRACT:
Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

REFERENCES:
patent: 4790912 (1988-12-01), Holtzman et al.
patent: 4946734 (1990-12-01), Sugawara
patent: 4999449 (1991-03-01), Kirchhoff
patent: 5055321 (1991-10-01), Enomoto

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