Abrading – Flexible-member tool – per se – Comprising fibers
Reexamination Certificate
2007-08-16
2010-11-09
Morgan, Eileen P. (Department: 3723)
Abrading
Flexible-member tool, per se
Comprising fibers
C451S526000, C451S527000, C451S536000, C451S537000, C451S533000
Reexamination Certificate
active
07828634
ABSTRACT:
The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
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Jiang Bo
Muldowney Gregory P.
Biederman Blake T.
Morgan Eileen P.
Rohm and Haas Electronic Materials CMP Holdings Inc.
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