Interconnected module

Details Interconnected module Interconnected module

1974-12-16

1977-11-22

Smith, Jr., David

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361412, H05K 500

Patent

active

040598497

ABSTRACT:
Solderable conductive strips bonded to ceramic insulator spacers interconnect terminals of adjacent substrates in a microcircuit module. Input-output connector pins are bonded to a selected base substrate and are electrically connected to the conductive strips which serve as through connecting means. Assembly and disassembly are accomplished by a reflow soldering procedure wherein hot gas is applied to the spacer-substrate interface, thereby minimizing the risk of substrate heat damage. The resulting electrical and mechanical connection is more reliable than the connection established by conventional structures having interconnecting pins since pin alignment stresses are eliminated.

REFERENCES:
patent: 2907926 (1959-10-01), Slack
patent: 2978612 (1961-04-01), Lutton
patent: 3087096 (1963-04-01), Jorgensen
patent: 3614541 (1971-10-01), Farrand

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