Interconnected leadless package receptacle

Details Interconnected leadless package receptacle Interconnected leadless package receptacle

1975-03-17

1977-08-30

Lake, Roy

Geometrical instruments

H05K 112, H05K 708

Patent

active

040451054

ABSTRACT:
A leadless package receptacle for mounting and interconnecting to electronic devices (e.g. leadless package) which can be interconnected with a second receptacle for packaging such devices, said receptacles having improved spring contact members. The receptacle incorporates a plurality of uniquely designed spring contacts for connection to a printed circuit board or other circuit member in a conventional manner. The spring contacts are arranged and configured within the receptacle to yieldably engage the lower surface of the leadless package so as to maintain a line contact. In addition, each spring member has a separate arm member to engage the spring contact members of the second package. The leadless package includes a chip carrier which has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts. Edge regions are cooperatively disposed on the carrier with respect to locking members on the receptacle for retaining the package in the receptacle. The receptacle also has alignment and interlocking means for accepting the second receptacle with the spring contact members of the second receptacle engaging the spring contact members of the first receptacle.

REFERENCES:
patent: 3212047 (1965-10-01), McDonough
patent: 3656183 (1972-04-01), Walterscheid
patent: 3696323 (1972-10-01), Kinkaid et al.
patent: 3700788 (1972-10-01), Spurck
patent: 3754203 (1973-08-01), Pauza et al.
patent: 3910664 (1975-10-01), Pauza et al.
patent: 3951495 (1976-04-01), Donaher et al.

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