Interconnect tape for use in tape automated bonding

Details Interconnect tape for use in tape automated bonding Interconnect tape for use in tape automated bonding

1986-01-31

1988-01-26

James,, Andrew

357 68, H01L 2348, H01L 2188

Patent

active

047219939

ABSTRACT:
An improved interconnect tape for use in tape automated bonding comprising a carrier member for supporting at least one pattern of interconnect leads. At least one first ring is provided having a plurality of sides with each of the sides supporting the leads extending inwardly of the member. Yieldable portions connecting the ring to the carrier member provide reduced stresses in the leads and reduced thermal dissipation during inner lead bonding.

REFERENCES:
patent: 3519890 (1970-07-01), Ashby
patent: 3902148 (1975-08-01), Drees et al.
patent: 4109096 (1978-08-01), Dehaine
patent: 4234666 (1980-11-01), Gursky
patent: 4331740 (1982-05-01), Burns
patent: 4400714 (1983-08-01), Brown
patent: 4496965 (1985-01-01), Orcutt et al.
"TAB Technology Tackles High Density Interconnections" by Tom Dixon, Dec. 1984, volume of Electronic Packaging & Production at pp. 34-39.

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