Interconnect system for integrated circuits

Details Interconnect system for integrated circuits Interconnect system for integrated circuits

1974-09-06

1976-03-23

Miller, Jr., Stanley D.

357 68, 357 69, H01L 2348, H01L 2944, H01L 2954

Patent

active

039464261

ABSTRACT:
An integrated circuit having a metal interconnect system formed with molybdenum engaging all contact areas of N conductivity type regions and aluminum engaging said molybdenum and engaging all contact areas of P conductivity type regions.

REFERENCES:
patent: 3614547 (1971-10-01), May
patent: 3649945 (1972-03-01), Waits
patent: 3757176 (1973-09-01), Kano et al.

Affiliated with

Also associated with

Rating

Interconnect system for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect system for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect system for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1647447