Interconnect system and method for inkjet devices using...

Details Interconnect system and method for inkjet devices using... Interconnect system and method for inkjet devices using...

2002-10-25

2004-08-17

Nguyen, Thinh (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S058000

Reexamination Certificate

active

06776475

ABSTRACT:

BACKGROUND OF THE DISCLOSURE
Print cartridges are typically mounted in a stall or chute for positioning in relation to a print zone. The cartridge and the stall are each provided with electrical contacts, so that an electrical interconnect between the cartridge and the stall can be established. In many print cartridges, the cartridge electrical contacts are provided on a THA, a TAB (Tape Automated Bonded) head assembly, flexible circuit which is bonded to the cartridge body. The stall also typically has a flexible circuit board with electrical contacts which are located to make contact with corresponding contacts on the THA circuit on the cartridge. The circuit contacts are typically copper or nickel contacts, which would be subject to corrosion. A gold or other protective metal layer, e.g. palladium, is formed over the copper or nickel contacts, to prevent corrosion. A thick gold layer, e.g. on the order of 30 microinches in thickness, is typically electroplated onto the contacts in order to survive multiple insertions of the cartridge into the stall, since gold wears off with every insertion. This adds to the expense of the print cartridge.
SUMMARY OF THE DISCLOSURE
An interconnect system for a device stall adapted to receive an inkjet device having a first set of electrical contact surfaces on a device surface. A second set of electrical contact surfaces is provided in a device stall. Respective ones of the first set and the second set are in facing alignment when the device is installed in the stall. An elastomeric layer is disposed between and in contact with the first and second sets of electrical contact surfaces, having a plurality of isolated conductive filaments or wires disposed therein between a first layer surface and a second layer surface. Conductor ends are exposed at the first and second layer surfaces, providing isolated electrical continuity between respective ones of the first set and the second set of electrical contact surfaces.


REFERENCES:
patent: 5461482 (1995-10-01), Wilson et al.
patent: 5598194 (1997-01-01), Hall et al.
patent: 6003974 (1999-12-01), Wilson et al.
patent: 6231168 (2001-05-01), Maze et al.
Greenstein et al., “A 2.5 MHz 2D Array with Z-Axis Electrically Conductive Backing”, Hewlett-Packard Laboratories, Palo Alto, CA; 9 pages.
Data Sheet, Shin-Etsu Polymer Co., Ltd., GB-E Type Inter-Connector, one page, http://www.shinpoly.co.jp/business/connector/apply_e/ic.htm.
Technology Trends, Using Conductive Elastomer Socketts for High Speed Packages, Chip Scale Review, Sep.-Oct. 2000, http://www.chipscalereview.com/issues/0900/techTrends.htm.

Affiliated with

Also associated with

Rating

Interconnect system and method for inkjet devices using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect system and method for inkjet devices using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect system and method for inkjet devices using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3343708