Interconnect system

Details Interconnect system Interconnect system

2006-09-05

2006-09-05

Dinh, Phuong (Department: 2839)

Electrical connectors

Electromagnetic or electrostatic shield

Multi-part shield body

Reexamination Certificate

active

07101224

ABSTRACT:
Disclosed herein are backplane interconnect systems that use surface mount technology for mating conductive pins in a header connector to surface mount pads on a printed circuit board. In particular, the interconnect system uses a plurality of conductive pins that are not fully inserted into the body of the header connector, thus allowing them to move during mating with a printed circuit board. In this way, the interconnect system exhibits self-leveling characteristics.

REFERENCES:
patent: 4695106 (1987-09-01), Feldman et al.
patent: 4726793 (1988-02-01), Bright
patent: 4927372 (1990-05-01), Collier
patent: 5174764 (1992-12-01), Kandybowski et al.
patent: 5755596 (1998-05-01), Watson
patent: 6146202 (2000-11-01), Ramey
patent: 6231391 (2001-05-01), Ramey et al.
International Search Report for PCT/US2004/024412.

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