Interconnect substrate with a single contact accessible in an up

Details Interconnect substrate with a single contact accessible in an up Interconnect substrate with a single contact accessible in an up

1994-12-02

2000-05-16

Palmer, Phan T. H.

Optical waveguides

Integrated optical circuit

385 27, 385 31, G02B 612

Patent

active

060647809

ABSTRACT:
An interconnect substrate is provided. The interconnect substrate has a first surface with a conductive path and an end surface. The first surface and the end surface join to form a nexus or a corner. A conductive contact is positioned at the nexus, thereby bridging the first surface and the end surface, as well as providing a conductive path from the first surface to the end surface. The conductive contact is operably coupled to the conductive path.

REFERENCES:
patent: 5282071 (1994-01-01), Hartman et al.

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