Interconnect structures using group VIII metals

Details Interconnect structures using group VIII metals Interconnect structures using group VIII metals

1995-01-19

1996-10-08

Gorgos, Kathryn

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257763, 257765, H01L 2940

Patent

active

055634494

ABSTRACT:
A multiple layer interconnect structure for a semiconductor chip includes a graded transition layer of tungsten and a Group VIII metal, such as palladium, platinum or nickel (Pd, Pt or Ni) which allows formation of a Group VIII metal interconnect on a conventional pad of Al or Al alloy. The graded transition layer is interfaced between a thin adhesion layer on the pad and the Group VIII metal interconnect, and is approximately 100% tungsten where it interfaces the adhesion layer and approximately 100% Group VIII metal where it interfaces the interconnect layer. The tungsten in the graded transition layer acts as a solder barrier and the Group VIII metal interconnect is compatible with the silicon substrate so that packaging processing steps, including lead soldering, can be carried out, and the chip electrically tested, in the semiconductor fabrication facility.

REFERENCES:
patent: 3231421 (1966-01-01), Schmidt
patent: 3239376 (1966-03-01), Schmidt
patent: 3906540 (1975-09-01), Hollins
patent: 3987217 (1976-10-01), Greeson et al.
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4507851 (1985-04-01), Joyner et al.
patent: 4880708 (1989-11-01), Sharma et al.
patent: 5134460 (1992-07-01), Brady
patent: 5348894 (1994-09-01), Gnade

Affiliated with

Also associated with

Rating

Interconnect structures using group VIII metals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect structures using group VIII metals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect structures using group VIII metals will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-59677