Interconnect structures having patterned interfaces to minimize

Details Interconnect structures having patterned interfaces to minimize Interconnect structures having patterned interfaces to minimize

1991-09-03

1993-10-12

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 428195, B32B 900

Patent

active

052523829

ABSTRACT:
Interconnect structures for integrated circuits and semiconductor chips are disclosed which employ patterned interfaces to minimize stress migration in the interconnects. The interfaces are patterned to have regions of substantially no adhesion and other regions of good adhesion. The regions of substantially no adhesion reduce stress migration in the interconnect, while the regions of good adhesion ensure adequate thermal contact, fabricability and mechanical integrity of the interconnect structures. The patterned interfaces can be formed either by treating the surfaces of the interconnect or adjacent insulator and passivation layers, or by forming patterned interlayers of material in the interfaces. Multiple layer interconnects can also be formed which incorporate similarly patterned interfaces.

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