Interconnect structure with replaced semiconductor chips

Details Interconnect structure with replaced semiconductor chips Interconnect structure with replaced semiconductor chips

1994-06-08

1996-01-30

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361760, 361767, 361765, 439 68, H05K 118

Patent

active

054882001

ABSTRACT:
A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about one half of the original height to planarize the surface. Another chip 4A having bump electrodes 6A is aligned with the bump electrodes 6 on the substrate 2, and bonded face down on the substrate. Finally, resin 14A is flowed into the gap between the chip 4A and the substrate 2 and around the chip 4A to encapsulate the chip.

REFERENCES:
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5250848 (1993-10-01), Christie et al.
patent: 5329423 (1994-06-01), Scholz

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