Interconnect structure with programmable IC for interconnecting

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

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257211, 257758, H01L 2710, H01L 2348

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active

056545649

ABSTRACT:
An interconnect structure is centered around a substrate having multiple component contacts for receiving electronic components. Multiple conductive traces are provided on the substrate. Each conductive trace is electrically connected to one of the component contacts. A programmable IC having a group of separate conductive leads is connected to the substrate. Two or more of the conductive leads are connected to corresponding conductive traces on the substrate. The IC has programmable elements for selectively connecting the conductive leads, thereby enabling a user to interconnect selected conductive traces on the substrate to achieve a desired electrical function from the electronic components connected to the substrate. The interconnect structure also contains circuitry for transmitting control signals to the programmable IC to control its configuration so as to control the interconnection of the conductive traces.

REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 4124899 (1978-11-01), Birkner et al.
patent: 4327355 (1982-04-01), Genter et al.
patent: 4354228 (1982-10-01), Moore et al.
patent: 4433331 (1984-02-01), Kollaritsch
patent: 4455495 (1984-06-01), Masuhara et al.
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4467400 (1984-08-01), Stopper
patent: 4479088 (1984-10-01), Stopper
patent: 4509008 (1985-04-01), Das Gupta et al.
patent: 4631686 (1986-12-01), Ikawa et al.
patent: 4649413 (1987-03-01), Kelly
patent: 4703436 (1987-10-01), Varshney
patent: 4706216 (1987-11-01), Carter
patent: 4717988 (1988-01-01), Landis
patent: 4727268 (1988-02-01), Hori
patent: 4758745 (1988-07-01), Elgamal et al.
patent: 4786904 (1988-11-01), Graham, III et al.
patent: 4813017 (1989-03-01), Wong
patent: 4817093 (1989-03-01), Jacobs et al.
patent: 4821176 (1989-04-01), Ward et al.
patent: 4847732 (1989-07-01), Stopper et al.
patent: 4866432 (1989-09-01), Goetting
patent: 4873459 (1989-10-01), El Gamal et al.
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4906987 (1990-03-01), Venaleck et al.
patent: 4949084 (1990-08-01), Schwartz et al.
patent: 5015885 (1991-05-01), El Gamal et al.
patent: 5036473 (1991-07-01), Butts et al.
patent: 5109353 (1992-04-01), Sample et al.
patent: 5504354 (1996-04-01), Mohsen
Wooley et al., "Active Substrate System Integration," IEEE, 1987, pp. 468-471.
Bogdan, "An Electrically Programmable Silicon Circuit Board," 1987, pp. 472-476.
Hantusch, "The PIM: A Programmable Interconnection Module," Nov. 1984, 4 pages.
"Logically Controlled Chip Interconnection Techniques", IBM Technical Disclosure Bull., Aug. 1989, pp. 294-299.
J. Donnell, "Crosspoint Switch: A PLD Approach," Digital Design, Jul. 1986, pp. 40-42, 44.

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