Interconnect structure having improved metallization

Details Interconnect structure having improved metallization Interconnect structure having improved metallization

1993-08-03

1995-07-25

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174261, 174262, H06K 102

Patent

active

054364124

ABSTRACT:
An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.

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IEEE, "Production of MCP Chip Carriers", M. E. Williams, 0569-5503/90-0000-0408 May, 1990.

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