Interconnect structure for transducer assembly

Details Interconnect structure for transducer assembly Interconnect structure for transducer assembly

2007-06-12

2007-06-12

Zarroli, Michael C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C310S334000

Reexamination Certificate

active

11315641

ABSTRACT:
An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.

REFERENCES:
patent: 5267221 (1993-11-01), Miller et al.
patent: 5744898 (1998-04-01), Smith et al.
patent: 6541896 (2003-04-01), Piel, Jr. et al.
patent: 6551248 (2003-04-01), Miller
patent: 6625854 (2003-09-01), Sudol et al.
patent: 2004/0100163 (2004-05-01), Baumgartner et al.
patent: 2005/0272183 (2005-12-01), Lukacs et al.

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