Batteries: thermoelectric and photoelectric – Photoelectric – Panel or array
Reexamination Certificate
2000-04-24
2001-11-06
Diamond, Alan (Department: 1753)
Batteries: thermoelectric and photoelectric
Photoelectric
Panel or array
C136S261000, C136S251000, C136S291000, C136S256000, C136S293000, C072S135000, C072S136000, C072S146000, C029S825000, C029S850000, C439S032000, C439S775000, C439S954000
Reexamination Certificate
active
06313395
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates generally to electrical interconnect structures, and more particularly the invention relates to interconnects which are subject to compressive and/or expansive forces in application.
Solar cell modules are used in high altitude and space applications where temperature subjects the modules to shrinkage. Further, in some applications planar arrays of solar cell submodules are packaged in a laminate structure between two layers of laminate material which shrink during packaging. The planar arrays are submodules containing a plurality of semiconductor substrates in which the solar cells are fabricated, and the substrates are serially electrically connected between bus bars which receive solar generated voltages. The interconnects typically comprise a metal layer of foil which is soldered or welded to contacts on adjacent substrates or between a substrate and a bus.
The shrinkage of the packaged modules can cause buckling of the metal foil interconnects and create ripples or an unevenness in the surface of the planar arrays. In some space applications the unevenness has deleterious effects. Heretofore, a through hole pattern has been used in foil interconnecting two substrates to reduce buckling, but the peripheral or bus interconnect must be a solid foil which does not permit use of the through hole pattern. Attempts at reducing buckling of the peripheral interconnect by embossing or by folding the foil have not been successful.
The present invention is directed to providing a metal foil peripheral or bus interconnect which reduces buckling when subjected to expansion and shrinkage.
SUMMARY OF THE INVENTION
Briefly, the bus interconnect comprises a flattened spiral of a strip of metal foil which allows for contraction without significant buckling.
In fabricating the bus interconnect, a strip of metal foil such as silver, for example, is wrapped around a cylindrical mandrel in a helical pattern with controlled pitch and tension. The mandrel is then removed leaving the helical spiral of foil. The foil is then flattened to reduce the thickness of the bus interconnect. The bus interconnect can also be formed by wrapping the foil around a flat mandrel or by directly folding into a flattened spiral.
The invention and objects and features thereof would be more readily apparent from the following detailed description and appended claims when taken with the drawing.
REFERENCES:
patent: 4044583 (1977-08-01), Kinney, Jr.
patent: 4845723 (1989-07-01), Heinen et al.
patent: 5158618 (1992-10-01), Rubin et al.
patent: 5632086 (1997-05-01), Helwig
patent: 5776334 (1998-07-01), Cho
Crane Richard A.
Daroczi Shandor G.
Piper Matthew B.
Diamond Alan
Sunpower Corporation
Townsend and Townsend / and Crew LLP
Woodward Henry K.
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