Interconnect structure for integrated circuits

Details Interconnect structure for integrated circuits Interconnect structure for integrated circuits

1987-11-20

1990-09-11

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

29840, 29850, 361386, 361412, 361408, H05K 720

Patent

active

049567497

ABSTRACT:
A semiconductor integrated device support structure having a transmission line interconnect structure in a metal block on which the devices are mounted. The metal block is formed photolithographically from layers which define X,Y sections of the block. A plurality of stacked layers contains the complete wireline interconnect network. Each wire is a true coaxial transmission line having an inner conductor, a surrounding dielectric material and an outer conductor. By appropriate choice of radii of the inner conductor and the surrounding dielectric material, favorable impedances may be selected.

REFERENCES:
patent: 3365620 (1986-01-01), Butler et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4665468 (1987-05-01), Dohya
patent: 4679321 (1987-07-01), Plonski

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