Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2011-04-26
2011-04-26
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257SE23068, C257S737000, C257S738000, C257S692000, C257S693000, C257S781000, C257SE23010, C257SE23021, C257S778000
Reexamination Certificate
active
07932613
ABSTRACT:
A semiconductor device having a device substrate is provided. The semiconductor device includes an electrically-conductive pad formed overlying the device substrate, and an electrically-conductive platform formed overlying the electrically-conductive pad and enclosing a cavity. The electrically-conductive platform has a perimeter portion extending away from the electrically-conductive pad and a capping portion atop the perimeter portion. The semiconductor device also includes a cushioning material disposed in the cavity.
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PCT International Search Report for PCT/US2010/027591 mailed Aug. 26, 2010.
Globalfoundries Inc.
Ingrassia Fisher & Lorenz P.C.
Williams Alexander O
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