Interconnect structure employing equivalent resistance paths to

Details Interconnect structure employing equivalent resistance paths to Interconnect structure employing equivalent resistance paths to

1998-08-17

1999-09-28

Niebling, John F.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257775, 257774, 257536, 438669, 438468, 438927, 438957, 438128, 438761, 438385, 438598, 438666, 438622, H01L 2348, H01L 2900, H01L 2144, H01L 21326

Patent

active

059593601

ABSTRACT:
A structure of a conductive line. The structure of a conductive line comprises a substrate with two conductive lines formed thereon. These two conductive lines are isolated by the formation of a dielectric layer. The conductive lines are electrically connected by a contact/via array. The contact/via array further comprises contact/via columns and contact/via rows made up of contacts/vias. Each contact/via column and contact/via row are added with a load resistor, so that the equivalent resistance of each contact/via is identical.

REFERENCES:
patent: 5101261 (1992-03-01), Maeda
patent: 5289036 (1994-02-01), Nishimoto
patent: 5461260 (1995-10-01), Varker et al.
patent: 5708291 (1998-01-01), Bohr et al.
patent: 5739587 (1998-04-01), Sato
patent: 5789783 (1998-08-01), Choundhury et al.

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