Interconnect structure and method of fabricating the same

Details Interconnect structure and method of fabricating the same Interconnect structure and method of fabricating the same

2008-08-20

2010-12-28

Talbot, Brian K (Department: 1715)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097100, C427S098500, C427S249100, C427S554000, C427S555000, C204S192150

Reexamination Certificate

active

07858147

ABSTRACT:
A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.

REFERENCES:
patent: 7094679 (2006-08-01), Li et al.
patent: 7312531 (2007-12-01), Chang et al.
patent: 2008/0159945 (2008-07-01), Chen et al.
patent: 2005-231952 (2005-09-01), None

Affiliated with

Also associated with

Rating

Interconnect structure and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect structure and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect structure and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4170671