Interconnect structure and method for connecting buried...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S760000, C174S260000

Reexamination Certificate

active

07018219

ABSTRACT:
An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

REFERENCES:
patent: 3875479 (1975-04-01), Jaggar
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5516303 (1996-05-01), Yohn et al.
patent: 6340606 (2002-01-01), Hashimoto
patent: 6366467 (2002-04-01), Patel et al.
patent: 6459592 (2002-10-01), Anzai
patent: 6593535 (2003-07-01), Gailus
patent: 2001/0018987 (2001-09-01), Tzanavaras et al.
patent: 2003/0133274 (2003-07-01), Chen et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interconnect structure and method for connecting buried... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect structure and method for connecting buried..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect structure and method for connecting buried... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3581038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.