Interconnect structure

Details Interconnect structure Interconnect structure

2009-02-25

2011-12-06

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

08071891

ABSTRACT:
A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines is formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.

REFERENCES:
patent: 6531661 (2003-03-01), Uchikawa et al.
patent: 6700457 (2004-03-01), McCall et al.
patent: 7301108 (2007-11-01), Egitto et al.
patent: 2004/0150970 (2004-08-01), Lee
patent: 2008/0116991 (2008-05-01), Gagnon et al.
patent: 2009/0183909 (2009-07-01), Cho

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