Interconnect structure

Details Interconnect structure Interconnect structure

2011-06-14

2011-06-14

Sandvik, Benjamin P (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE21578, C257SE23167

Reexamination Certificate

active

07960838

ABSTRACT:
An interconnect structure is described, disposed on a substrate with a conductive part thereon and including a dielectric layer, a composite plug and a conductive line. The dielectric layer is disposed on the substrate covering the conductive part. The composite plug is disposed in the dielectric layer electrically connecting with the conductive part, and includes a first plug and a second plug on the first plug, wherein the material or the critical dimension of the second plug is different from that of the first plug. The conductive line is disposed on the dielectric layer electrically connecting with the composite plug.

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patent: 2001/0030372 (2001-10-01), Mori et al.
patent: 2002/0093098 (2002-07-01), Barr et al.
patent: 2002/0113237 (2002-08-01), Kitamura
patent: 1269607 (2000-10-01), None
patent: 1396647 (2003-02-01), None
patent: 1402325 (2003-03-01), None

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