Interconnect stress test coupon

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324 731, 3241581, 324537, 324538, G01R 3102

Patent

active

054518857

ABSTRACT:
This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet which is used for mounting the test coupon as well as housing a number of the other components that make up the system. During a pre-cycling phase, the system determines the correct current that should be passed through the coupon in order to heat it to a predetermined temperature. After that test current value is determined the system actually stress tests the coupon by passing the determined test current through the coupon. It does so for a selected number of cycles, and monitors resistance changes in the coupon during testing while recording test data. This disclosure also describes the test coupon, which is designed to uniformly dissipate the heat created during stress cycling.

REFERENCES:
patent: 4510446 (1985-04-01), Braun
patent: 4894606 (1990-01-01), Paur
patent: 4985675 (1991-01-01), Turndic
patent: 5172063 (1992-12-01), Munikoti et al.
Munikoti, R. and Dhar, P. "A New Power Cycling Technique for Accelerated Reliability Evaluation of Plated Through Holes and Interconnects in PCB's"; IEEE Transactions on Components Hybrids, and Manufacturing Technology Dec. 1990 vol. 13, No. 4, pp. 865-872.
Munikoti, R. and Dhar, P. "New Power Cycling Technique for Accelerated Reliability Evaluation of Plated-Through-Holes and Interconnects in PCBs"; 40th Electronic Components and Technology Conference in Las Vegas May 1990 17 pages.
Strang, M. "Power cycling"; Quality Sep. 1980 pp. 29-31.
Murcko, R. and Tomine, J. "Detecting Subtle Flaws with Temperature Cycle Testing"; Circuits Manufacturing Dec. 1982 pp. 63-65.

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