Geometrical instruments
Patent
1978-06-21
1980-01-01
Abrams, Neil
Geometrical instruments
29626, 339221R, 339275B, H05K 112
Patent
active
041813871
ABSTRACT:
Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19) inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film" conductive inks.
REFERENCES:
patent: 2640903 (1953-06-01), Kohring
patent: 3120418 (1964-02-01), Deakin
patent: 3187298 (1965-06-01), Shannon
patent: 3202755 (1965-08-01), Oswald
patent: 3428934 (1969-02-01), Reider, Jr., et al.
patent: 3573707 (1971-04-01), Reynolds
patent: 3681738 (1972-08-01), Friend
patent: 3710196 (1973-01-01), Fifield
patent: 3975072 (1976-08-01), Ammon
patent: 3992076 (1976-11-01), Gluntz
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4050772 (1977-09-01), Birnholz et al.
Abrams Neil
Landis J. L.
Western Electric Company Inc.
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