Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-04-24
2007-04-24
Le, Thao X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S778000, C257SE23001
Reexamination Certificate
active
10883419
ABSTRACT:
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution and reliability redundancy. The first and second bumps provide a first and second electric current pathway between the integrated circuit and package substrate. The shunt provides a third electric current pathway between the first bump and the second bump.
REFERENCES:
patent: 5255839 (1993-10-01), da Costa Alves et al.
patent: 5741729 (1998-04-01), Selna
patent: 6501185 (2002-12-01), Chow et al.
patent: 6891266 (2005-05-01), Kinayman et al.
Bohr Mark
He Jun
Hua Fay
Wood Dustin P.
Blakely , Sokoloff, Taylor & Zafman LLP
Hafiz Mursalin B.
Le Thao X.
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