Interconnect routing using parallel lines and method of...

Details Interconnect routing using parallel lines and method of... Interconnect routing using parallel lines and method of...

2006-03-21

2006-03-21

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C438S625000, C438S631000, C438S637000

Reexamination Certificate

active

07014957

ABSTRACT:
The subject invention is a system, apparatus and/or method of forming interconnects on a semiconductor wafer. Particularly, the subject invention provides interconnect routing using parallel lines on a semiconductor wafer. The method includes producing a plurality of spaced, parallel interconnects on a wafer, and producing interruptions in selective ones of the plurality of interconnects where the connection should be disrupted. Preferably, the plurality of spaced, parallel lines are formed over the entire die region of the wafer and are spaced from one another by a predetermined width. In one form, a mask having a plurality of spaced, parallel lines may be used.

REFERENCES:
patent: 6015641 (2000-01-01), Chou

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