Interconnect packaging systems

Details Interconnect packaging systems Interconnect packaging systems

2006-11-15

2009-10-27

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S723000, C257S777000, C257SE23085, C257SE23151, C257SE23152, C257SE23175, C257SE23178

Reexamination Certificate

active

07608919

ABSTRACT:
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

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