Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2001-04-10
2004-06-22
Le, N. (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S523000, C324S555000
Reexamination Certificate
active
06753688
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to testing and repair of wiring interconnect packages. Specifically, a single apparatus performs not only a test for opens and shorts, but additionally provides the capability to make attempts to remove those shorts identified during the testing phase.
2. Description of the Related Art
Like any electronic component, wiring interconnect products (such as PC boards, substrates or other type of networks) can complete manufacture with one or more shorts.
Conventional systems that attempt to correct shorts in an interconnect package typically utilize one of several methods. First, the elements which exhibit the short defect are located by an electrical test and the physical location of the external portion of the elements, which can be probed, are recorded. A pair of probes are then manually brought into contact with the identified elements and a pulse of electrical energy is applied to the elements. The electrical energy is turned on externally by using a foot switch or other suitable means. Another method uses a pair of auto-programmed x, y, z motion probes and then auto-selects the pulsing operation.
Both methods require that the interconnect product be tested, the location of the short be recorded on paper, magnetic media or other suitable means, and that this information be conveyed to the short repair station. The first method is very time consuming and subject to mis-probing and product damage such as scratching and other handling errors. The second method requires a separate defect data format for each part (serialization) in addition to a separate and expensive mechanical positioning system.
U.S. Pat. No. 5,290,986 to Colon, et. al., incorporated herein by reference, describes a thermally driven process capable of eliminating inadvertent electrical connections in electronic packages using a current pulsing repair process.
Other methods might use manually-held probes for pulsing, or they may not use a process at all and would merely scrap the product without attempting a rework.
SUMMARY OF THE INVENTION
In view of the foregoing and other problems, it is, therefore, an object of the present invention to provide a structure and method for identifying opens and shorts, and eliminating the shorts in an interconnect package using the same machine and the same location in the manufacturing process.
It is another object of the present invention to simplify the identification and repair process for shorts on interconnect packages.
It is yet another object of the present invention to provide an automated technique of identification and elimination of shorts in an interconnect package.
It is yet another object of the present invention to provide an automated technique to retest a package following an attempt to eliminate an identified short.
It is yet another object to provide a method and apparatus that reduces manufacturing and testing time for interconnect packages.
It is yet another object to improve reliability of interconnect packages.
It is yet another object to improve yield of interconnect packages.
It is yet another object to provide a test/repair apparatus having a variety of possible testing/repair modes, so that an operator can choose the most efficient mode or modes depending upon type and characteristics of the product.
It is yet another object to provide a test/repair apparatus that reduces repair time compared to a manual process.
It is yet another object to provide a test/repair apparatus that allows a higher stress voltage to be applied during repair procedures than would be safe for a manual repair procedure.
In order to attain the above objects, according to one aspect of the invention, an electronic circuit test and repair apparatus, including at least one wiring analyzer to locate circuit shorts, a current source to provide current sufficient to remove the shorts, and at least two probes to contact a circuit on a product under evaluation.
According to another aspect of the invention, a method of testing and repair of wiring interconnect packages includes contacting at a predetermined set of locations a wiring interconnect package under test using a cluster probe containing a plurality of probes, applying a predetermined set of voltage levels in a predetermined sequence to predetermined probes in the cluster probe, measuring a response to each application of voltages to detect any abnormal open or short circuits in the wiring interconnect package, and for any detected short circuits, applying a predetermined voltage to attempt to remove the detected short circuit, wherein the applying of voltages and the measuring of responses to detect any short circuits uses a same apparatus that is used for the attempt to remove the short circuits.
According to yet another aspect of the invention, a method of automatically testing and repairing wiring interconnect packages, includes contacting at a predetermined set of locations a wiring interconnect package under test using a cluster probe containing a plurality of probes, automatically applying a predetermined set of voltage levels in a predetermined sequence to predetermined probes in the cluster probe, automatically measuring a response to each application of voltages to detect any abnormal open or short circuits in the wiring interconnect package, and, for any detected short circuits, automatically applying a predetermined voltage to attempt to remove the detected short circuit.
According to yet another aspect of the invention, an apparatus for testing and repair of wiring interconnect packages includes at least one wiring analyzer to locate circuit shorts, a current source to provide current sufficient to remove the shorts, and a cluster probe to contact a wiring interconnect package under evaluation.
The disclosed single-station test and repair apparatus and process provides the advantages of saving time and expense and helps eliminates logistics errors associated with multiple stations. The test and repair process can be either manually or automatically controlled and can have more than one testing speed. The automatic procedure provides safety for the operator since possible exposure to high voltage during testing or repair is eliminated. The cluster probe allows multiple points in a circuit to be contacted, thereby saving the time of repositioning probes. An overvoltage stress test capability provides additional reliability for repaired shorts.
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Eddy Roger M.
Hendricks Charles J.
Morrison Thomas
Wiggin Robert N.
Wojszynski Brian J.
Cioffi, Esq. James J.
Dole Timothy J.
International Business Machines - Corporation
Le N.
McGinn & Gibb PLLC
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