Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-08-29
2006-08-29
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S778000, C257SE23169, C257SE23175, C438S108000
Reexamination Certificate
active
07098541
ABSTRACT:
A method and related configuration for stacking and interconnecting multiple identical integrated circuit semiconductor die. A die designed in accordance with the present invention can be directly interconnected with other identical die by placing a second die on a first die. The second die is substantially identical to the first die and has a rotation with respect to the first die. A plurality of electrical interconnections on the first die are contacted with a plurality of electrical interconnections on the second die, forming electrical interconnects between adjacent stacked dies.
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United Kingdom Patent Office Search Report dated Sep. 28, 2004, 3 pp.
Hewlett--Packard Development Company, L.P.
Landau Matthew C.
Parker Kenneth
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