Interconnect lead with stress joint

Details Interconnect lead with stress joint Interconnect lead with stress joint

1992-09-09

1993-11-09

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

1741263, 361772, H05K 100

Patent

active

052605175

ABSTRACT:
An interconnect lead (12) has trenches (28) that function as stress joints to inhibit the formation of stress related defects, such as cracks and hillocks. The interconnect lead is formed by a continuous layer (18) of a refractory metal alloy and a segmented layer (22) of an aluminum alloy. The stress joints are formed by using a high resolution microlithographic process (48) to etch the narrow trenches in a transverse direction to the length of the conductor through the aluminum layer.

REFERENCES:
patent: 4606788 (1986-08-01), Moran
patent: 4899439 (1990-02-01), Potter et al.

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