Interconnect layout method

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – With electrical circuit layout

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S599000

Reexamination Certificate

active

11244137

ABSTRACT:
In an interconnect layout 100, the first gate pattern, the second gate pattern, the first dummy pattern, and the second dummy pattern are arranged so that, if a wavelength of a light used to expose the first gate pattern and the second gate pattern is λ, natural numbers are m1, m2, and m3, the first predetermined distance is P1, the second predetermined distance is P2, the third predetermined distance is P3, a design value of the first predetermined distance is P1′, a design value of the second predetermined distance is P2′, and a design value of the third predetermined distance is P3′, then the first predetermined distance satisfies relationships of P1=m1λ and P1′−0.1λ≦P1≦P1′+0.1λ, the second predetermined distance satisfies relationships of P2=m2λ and P2′−0.1λ≦P2≦P2′+0.1λ, and the third predetermined distance satisfies relationships of P3=m3λ and P3′−0.1λ≦P3≦P3′+0.1λ.

REFERENCES:
patent: 5459093 (1995-10-01), Kuroda et al.
patent: 6261883 (2001-07-01), Koubuchi et al.
patent: 6413847 (2002-07-01), Yeh et al.
patent: 6905967 (2005-06-01), Tian et al.
patent: 7153728 (2006-12-01), Morita
patent: 2002/0179941 (2002-12-01), Ootake et al.
patent: 2004/0152243 (2004-08-01), Kuroda et al.
patent: 09-311432 (1997-12-01), None
patent: 2000-112114 (2002-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interconnect layout method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect layout method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect layout method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3840111

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.