Interconnect formation utilizing real-time feedback

Details Interconnect formation utilizing real-time feedback Interconnect formation utilizing real-time feedback

1992-06-23

1993-07-27

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, 228 45, 228 9, H01L 21607

Patent

active

052304582

ABSTRACT:
The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to a real-time feedback circuit. The feedback circuit transmits a force adjustment signal to a z-motion actuator to adjust the force applied to the bond site.

REFERENCES:
patent: 3727822 (1973-04-01), Umbaugh
patent: 4438880 (1984-03-01), Smith et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4789095 (1988-12-01), Kobayashi
patent: 4806193 (1989-02-01), Von Raben et al.
patent: 4814848 (1989-04-01), Gabaldon
patent: 4854494 (1989-08-01), von Raben
patent: 5060841 (1991-10-01), Oshima et al.

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