Interconnect for layered integrated circuit assembly

Details Interconnect for layered integrated circuit assembly Interconnect for layered integrated circuit assembly

1989-01-17

1989-07-04

Edlow, Martin H.

357 69, 357 65, 357 75, H01L 2348

Patent

active

048455423

ABSTRACT:
Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate precisely configured metal posts which serve as such interconnections.

REFERENCES:
patent: 4021838 (1977-05-01), Warwick
patent: 4074342 (1978-02-01), Honn et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4545610 (1985-10-01), Lakvitz et al.

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