Interconnect device

Details Interconnect device Interconnect device

2008-01-08

2008-01-08

Connelly-Cushwa, Michelle (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S047000, C385S049000, C385S050000, C385S088000, C385S092000

Reexamination Certificate

active

10909611

ABSTRACT:
An apparatus is provided that includes a substrate having a top surface, at least one optical data transport medium coupled to the substrate, one or more lens devices coupled to the substrate, and one or more reflective devices coupled to the substrate. The one or more lens devices and the one or more reflective devices are at least partially passively aligned with the at least one optical transport medium by use of one or more pins.

REFERENCES:
patent: 4379613 (1983-04-01), Coburn
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 5357403 (1994-10-01), Haller et al.
patent: 5428704 (1995-06-01), Lebby et al.
patent: 5449427 (1995-09-01), Wojnarowski et al.
patent: 5525190 (1996-06-01), Wojnarowski et al.
patent: 5577142 (1996-11-01), Mueller-Fiedler et al.
patent: 5737458 (1998-04-01), Wojnarowski et al.
patent: 5911022 (1999-06-01), Plickert et al.
patent: 6453091 (2002-09-01), Kawai
patent: 6641310 (2003-11-01), Williams
patent: 6739766 (2004-05-01), Xu et al.
patent: 6768061 (2004-07-01), Kondo
patent: 6823109 (2004-11-01), Sasaki et al.
patent: 6901185 (2005-05-01), Sasaki et al.
patent: 7040814 (2006-05-01), Morimoto et al.
patent: 7063467 (2006-06-01), Nagasaka et al.
patent: 2002/0096686 (2002-07-01), Raj et al.
patent: 2002/0102060 (2002-08-01), Jewell et al.
patent: 2004/0184737 (2004-09-01), Oono et al.
patent: 2005/0225864 (2005-10-01), Kornrumpf et al.
patent: 2006/0215963 (2006-09-01), Hamano
Brown, Paul B. New Engineering Thermoplastic Options for Insulating Systems. GE Plastics. pp. 130-132, 1989.
Brown, Paul B. New Engineering Thermoplastic Options for Insulating Systems. GE Plastics. pp. 130-132 (Provided to the Applicant Jun. 9, 2005).
K. Katsura, et al, Packaging for a 40-Channel Parallel Optical Interconnection Module With an Over 25-GB/S Throughput, 1998 Electronic Components and Technology Conference, 1998 IEEE, pp. 755-761.
BPA Consulting LTD, “Optical Backplane Technologies and Players”, BPA Report No. 762, pp. 6-1-6-34, 7-1-7-13.

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