Interconnect assembly for testing integrated circuit packages

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S091000

Reexamination Certificate

active

07402051

ABSTRACT:
An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.

REFERENCES:
patent: 6565395 (2003-05-01), Schwarz
patent: 6685492 (2004-02-01), Winter et al.
patent: 6787709 (2004-09-01), Vinther
patent: 6866519 (2005-03-01), Fan et al.
patent: 6909056 (2005-06-01), Vinther
patent: 7040902 (2006-05-01), Li
patent: 7147478 (2006-12-01), Ju
patent: 7297004 (2007-11-01), Shuhart et al.
patent: 2004/0053539 (2004-03-01), Watanabe
patent: 2005/0266734 (2005-12-01), Kazama
patent: 2006/0189176 (2006-08-01), Li
patent: 2006/0211276 (2006-09-01), Li
patent: 2007/0026699 (2007-02-01), Tahahashi et al.

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