Interconnect assemblies and methods

Details Interconnect assemblies and methods Interconnect assemblies and methods

2007-01-30

2009-11-17

Abrams, Neil (Department: 2839)

Electrical connectors

Including handle or distinct manipulating means

Randomly manipulated implement

Reexamination Certificate

active

07618281

ABSTRACT:
Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits.

REFERENCES:
patent: 923327 (1909-06-01), Burton
patent: 3193793 (1965-07-01), Plunkett et al.
patent: 3290636 (1966-12-01), Overtveld
patent: 3573617 (1971-04-01), Randolph et al.
patent: 3794953 (1974-02-01), Malin
patent: 3842189 (1974-10-01), Southgate
patent: 3936930 (1976-02-01), Stern
patent: 4029375 (1977-06-01), Gabrielian
patent: 4202588 (1980-05-01), Dalamangas et al.
patent: 4209745 (1980-06-01), Hines
patent: 4239312 (1980-12-01), Myer et al.
patent: 4352061 (1982-09-01), Matrone
patent: 4428633 (1984-01-01), Lundergan et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4615573 (1986-10-01), White et al.
patent: 4770641 (1988-09-01), Rowlette
patent: 4813129 (1989-03-01), Karnezos
patent: 4871316 (1989-10-01), Herrell et al.
patent: 4988306 (1991-01-01), Hopfer, III et al.
patent: 5030109 (1991-07-01), Dery
patent: 5067007 (1991-11-01), Otsuka et al.
patent: 5136238 (1992-08-01), Kade
patent: 5172050 (1992-12-01), Swapp
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5252916 (1993-10-01), Swart
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5338208 (1994-08-01), Bross et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5373231 (1994-12-01), Boll et al.
patent: 5475317 (1995-12-01), Smith
patent: 5476211 (1995-12-01), Khandros
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5498902 (1996-03-01), Hara
patent: 5555422 (1996-09-01), Nakano
patent: 5574384 (1996-11-01), Oi
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5633535 (1997-05-01), Chao et al.
patent: 5690270 (1997-11-01), Gore
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5773986 (1998-06-01), Thompson et al.
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5869961 (1999-02-01), Spinner
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5952840 (1999-09-01), Farnworth et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6043563 (2000-03-01), Eldridge et al.
patent: 6049976 (2000-04-01), Khandros
patent: 6060894 (2000-05-01), Hembree et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6224396 (2001-05-01), Chan et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 6664628 (2003-12-01), Khandros et al.
patent: 6705876 (2004-03-01), Eldridge et al.
patent: 6948941 (2005-09-01), Eldridge
patent: 7084650 (2006-08-01), Cooper et al.
patent: 7169646 (2007-01-01), Eldridge et al.
patent: 2002/0019152 (2002-02-01), Eldridge et al.
patent: 2006/0261827 (2006-11-01), Cooper et al.
patent: 295914 (1988-12-01), None
patent: 2680284 (2003-09-01), None
patent: 59-87842 (1984-05-01), None
patent: 64-47090 (1989-02-01), None
patent: 05-64784 (1993-08-01), None
patent: 06-069663 (1994-03-01), None
patent: 07-94560 (1995-04-01), None
patent: 09-21828 (1997-01-01), None
patent: 09-45740 (1997-02-01), None
patent: 09-512139 (1997-12-01), None
patent: 10-125857 (1998-05-01), None
patent: WO 96/15459 (1996-05-01), None
patent: WO 96/16440 (1996-05-01), None
patent: WO 96/38858 (1996-12-01), None
patent: WO 96/38858 (1996-12-01), None
patent: WO 97/16866 (1997-05-01), None
patent: WO 97/16866 (1997-05-01), None
patent: WO 97/43654 (1997-11-01), None
patent: WO 98/01906 (1998-01-01), None
Clark, et al., “Joining Integrated Circuit Chips to Microcast Fingers,” IBM Technical Disclosure Bulletin, vol. 12, No. 11, pp. 1981-1982 (Apr. 1970).

Affiliated with

Also associated with

Rating

Interconnect assemblies and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect assemblies and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect assemblies and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4095273