Interconnect assemblies and methods

Details Interconnect assemblies and methods Interconnect assemblies and methods

2007-01-30

2007-01-30

Abrams, Neil (Department: 2839)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

Reexamination Certificate

active

11237090

ABSTRACT:
Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. The stop structure may be formed as a sheet with openings and applied to an unsingulated semiconductor wafer with resilient contacts located in the openings.

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